Profileimage by Leonid Kulskyi Turnkey Electronics Design Services ; High-speed SCH / PCB  (Layout) design ; Automotive, Industrial from Karlsruhe

Leonid Kulskyi

available
Contact

Last update: 02.10.2021

Turnkey Electronics Design Services ; High-speed SCH / PCB (Layout) design ; Automotive, Industrial

Company: ProtoDev
Graduation: 2005
Hourly-/Daily rates: show
Depends on project complexity
Languages: German (Elementary) | English (Full Professional) | Russian (Native or Bilingual) | Ukrainian (Native or Bilingual)

Keywords

PCB Schematics layout Elektronik Edge Computing Altium Designer ADAS Autonomous Driving Hardware Soc

Attachments

Laser_Patent_Leonid_Kulskyi.pdf
Reference_Letters_MLX_LTG.pdf
Visteon_Reference_Letter.pdf
Certificats_Leonid_Kulskyi_.pdf
Freelancer_Electronics_Hardware_CV_Kulskyi.pdf
Electronics_Design_Portfolio_m.pdf
Leonid_Kulskyi_Elektronik_Entwicklung_DE.pdf

Skills

Summary:  15+ years of experience in Electronics :
From Gadgets / controllers / IoT_devices to Industrial and Automotive High-Speed multi-CPU / SoC and multi-PCB cutting-edge solutions ... even for Autonomous Driving platforms (Visteon's DriveCore).

I have designed systems with the next interfaces : DDR3/DDR4 / PCIe / M.2 / SATA / 100 Mpbs to 10/40Gb Ethernet / USB 3.1 / and a lot of newest wireless technologies like 3G / 4G / GSM / GPRS / BT / BLE / WiFi / UWB / LoRa etc. Fresh SoC experience with nVidia Xavier, Tegra, Texas Instruments SoCs, iMX6, iMX8, etc.

My services are: Hardware Design and Development (from idea to full mass-production), Hardware Consulting (SCH/PCB review), 3D sketching, 3D parts/enclosures design for prototypes as well as for plastic/metal mass-production, TurnKey projects: from scratch to CE/FCC certified mass-production! P.S. A couple of patents obtained (most interesting one - Laser Vision System)

Project history

07/2021 - Present
Professional Electronic Hardware Design and Development (Edge computers, IoT)
Freiberufler (< 10 employees)
Industry and mechanical engineering
Professional Electronic Hardware Design and Development (Edge computers, IoT);
Turnkey Projects : Architecture, Schematics, PCB Layout (2 - 12 Layers, HDI with laser vias and buried vias);

Capabilities include (but are not limited to):

  • Processors
    • Exotic ARM Cores
    • Texas Instruments SoC
    • Qualcomm
    • nVidia SoC (Volta, Ampere, Orin)
    • NXP iMX6 / iMX8 SoC
    • Broadcom SoC
    • Allwinner SoC
  • Computing Modules
    • nVidia SoMs (Nano, TX, NX, TX2, AGX)
    • iMX6 / iMX8 based
    • Raspberry Pi (zero, 3, 4)
  • Microcontrollers
    • ESP32 series
    • Microchip PIC series / AVR series (ex Atmel)
    • STM8/32 series
    • Renesas
    • Infineon
  • Sensor interfaces and signal conditioning
  • Video interfaces DP, HDMI, LVDS, GMSL, FPD-Link, MIPI CSI and DSI
  • Data acquisition (FPGA usage: Xilinx, Intel, Lattice, etc.)
  • Digital communications
    • PCI express (M.2 , mPCIe, PCIe 1x – 16x)
    • USB ( 2.0 , 3.0, 3.1 , 3.2 )
    • Ethernet ( EtherCAT, 100BASE-T/T1, 1000BASE-T/T1, 10G, 40G)
    • SPI / i2C / I2S
    • RS232 / RS485 / RS422
    • Modbus
    • Profibus
    • CAN bus (CAN, CAN FD)
    • XMC / PMC ( VITA 42, VITA 61 )
  • Wireless communications
    • WiFi (2,4GHz, 5GHz, Custom frequencies)
    • Bluetooth (BT, BLE)
    • NFC
    • Cellular ( 3G / 4G / 5G )
    • Custom Sub 1GHz

07/2020 - 07/2021
Technical Professional (Hardware High-Speed Design)
Visteon (5000-10.000 employees)
Automotive and vehicle construction
Professional history:
Technical Professional (TP) - High Speed Design Visteon (Karlsruhe, Germany, May 2020 – till now)
Leading EE projects and sync with ECAD/Thermal/Software Teams (PM and PDTL support)  HW Architecture design/development activities for RFQ/RFI, interfacing with Customers  High-speed SCH design/simulations and pre/post layout check (communications with PCB fabs)  TDR analysis and WCCA checks; Cooperation with International Teams (EU, USA, Asia)

High Speed Data + Video Interface Engineer (Pre-TP) Visteon (Karlsruhe, Germany, Apr 2019 – May 2020) 
Scope of projects – ADAS/Autonomous driving systems  Focused on global support for ADAS/AD projects with high speed interfaces (DDR, PCIe, Video, etc.)  Applying expertise for Pre-Layout and Post-Layout SI/PI, TDR, WCCA calculations and reviews  Pre “Technical Professional” status: support for RFI/RFQ processes for EU projects

Senior Hardware Design Engineer Visteon (Karlsruhe, Germany, Dec 2017 – present) 
Scope of projects – ADAS/Autonomous driving systems (SmartCore/DriveCore)  Electronics Design and Developing for Visteon Platforms - implementation of appropriate components/systems to fulfill hardware architectural metrics set to the functions/features  Usage of most modern SoCs, high-speed and other types of interfaces  Customer requirements analysis and defining the key electronic components  Designing efficient power supply taking into account ASIL(B,C,D) requirements  Being in touch with the Suppliers to follow the newest components and practices on the market  Close cooperation with Hardware Architecture Team to implement optimal solutions  Cooperation with PCB Layout, Mechanical, Thermal Simulation and Signal Integrity Teams  3D Mecha Design sketching, hands-on experience in Proto-lab for fast prototyping needs  Optimal component search and selection, BOM analysis to meet cost/quality needs

04/2019 - 05/2020
High Speed Data + Video Interface Engineer (Pre-TP)
Visteon
* Scope of projects - ADAS/Autonomous driving systems
* Focused on global support for ADAS/AD projects with high speed interfaces (DDR_X, PCIe_X,etc)
* Applying expertise for Pre-Layout and Post-Layout SI/PI, TDR, WCCA calculations and reviews
* Pre "Technical Professional" status: support for RFI/RFQ processes for EU projects

12/2017 - 04/2019
Senior Hardware Engineer
Visteon
* Scope of projects - ADAS/Autonomous driving systems (SmartCore/DriveCore)
* Electronics Design and Developing for Visteon Platforms - implementation of appropriate
components/systems to fulfill hardware architectural metrics set to the functions/features
* Usage of most modern SoCs, high-speed and other types of interfaces
* Customer requirements analysis and defining the key electronic components
* Designing efficient power supply taking into account ASILx/ISO26262 requirements
* Being in touch with the Suppliers to follow the newest components and practices on the market
* Close cooperation with Hardware Architecture Team to implement optimal solutions
* Cooperation with PCB Layout, Mechanical, Thermal Simulation and Signal Integrity Teams
* 3D Mecha Design sketching, hands-on experience in Proto-lab for fast prototyping needs
* Optimal component search and selection, BOM analysis to meet cost/quality needs

01/2017 - 11/2017
Hardware System Engineer
Panasonic Automotive
* Customer requirements analysis, feasibility study and feedback negotiations
* Scope of projects - Auto Infotainment systems: Main Head Unit and Rear Seats Entertainment
* High level system block diagrams design for initial hardware architecture concept
* Key components comparison analysis for optimal choice (SoC, RAM, Power, Wireless, PCB)
* Communication with Suppliers regarding components and implementation practice
* Certification negotiations regarding approaches and planning (EMC, USB, ETH, Wireless)
* Working closely with departments: HW, SW, Mechanical, Display, Test, Logistics.
* Participating in HW bring-up activities, preliminary measurements and param.testing

08/2015 - 01/2017
Hardware Lead Engineer
Leantegra
* Design, Prototyping and mass-production adaptations of wireless devices for RTLS/Proximity :
WiRange (1 GHz ARM CPU, DDR3, NAND Flash, Ethernet, DC-DC, WiFi, BT, BLE, UWB, PoE, USB,
PCIe, FPGA) and WiBeat (STM32x MCU, BLE, UWB), Intel WiFi/BT modules implementation
* Layout and bring-up of PCBs with RF and high-speed interfaces (CAD Altium Designer)
* R&D and Characterization activities: Automated test data collecting (C/C++, MCU, LabView),
Heat distribution analysis (CAD SolidWorks Flow Simulation); EMC,EMI, RF analysis (CST Studio),
Antennas RF characterization (-PCB, -connectors, -air signal loss; diagram direction optimizing)
* Was involved into CE, FCC and EN certification process for mentioned devices (passed them)
* Cross-team coordination and collaboration with Mechanical, Embedded, QA and Software
engineers

05/2013 - 08/2015
Senior Hardware Design Engineer
ZX-NET ISP, Engineering department
* Collected and defined Customer requirements
* Created products starting from idea to working prototypes with full documentation support
(AVR MCU, 100Base-TX and -FX Fiber interface, RS-485, RS-232, Wi-Fi)
* Lead a team of developers to write embedded software for designed LAN device

08/2007 - 05/2013
Automotive Hardware Test Engineer
Melexis NV
* Designed mixed-signal and digital solutions with respect to Customer requirements
* Created test environment for innovative optical 3D sensors (for ToF chips, used in BMW 7)
* Developed mixed-signal circuits for robotized testing machines (ATE) for integrated circuits
mass production with respect to AEC-Q /TS16949 Automotive requirements




* Created time-optimized (cost-effective) software on C++ and Assembler for automated
semiconductor chips testing (optimized for direct Silicon Wafers test and for packaged
integrated circuits)
* Analyzed the results of integrated circuit measurements during mass-production and made
necessary remarkable conclusions to solve improvement tasks
* Attended seminars on technical scheduling, developments, and abilities to solve testing and
design problems
* Created design documentation according to customer specifications and requirements
* Worked closely with design and characterization engineers to research solutions and obtain
better characteristics of integrated circuits
* Implemented test solutions (Hardware and Software) on Melexis international manufacture
locations (Germany, Belgium, Bulgaria)

07/2006 - 07/2007
Electronics Design Engineer
VEDEKON , Engineering department
* Developed schematics and PCB for embedded monitoring and control (RF base station modules
based on 8bit, 32bit MCUs, simple FPGAs)
* Created software on C/C++/ASM for Microcontrollers for base station modules
* Prepared technical documentation including drawings, test instructions and full description.
* Managed project schedules from idea to pre-production models (prototypes)

03/2004 - 01/2006
Hardware/Software Development Engineer
National Ukrainian Centre of Certification and Metrology
* Designed schematics and PCBs for embedded flow-counter devices (based on AVR MCU 8bit)
* Wrote C/C++ code both for PC (Windows) and MCUs (internal firmware)
* Wrote design documentation regarding to customer specifications and requests
* Attended international conferences concerning heat measurement problems

08/2005 - 10/2005
Cellular GSM-GPRS modules / FPGAs Sales Engineer
VD MAIS Electronic Components Distribution Company
* Customer support; Sales activities : calls, logistics, shipment planning
* Actel FPGA and Altera FPGA sales engineering activities

Time and spatial flexibility

Remote projects are preferable.

Other

https://protodevs.eu
https://www.linkedin.com/in/leonidkulski/

Experienced in ECAD design software for SCH/PCB (Mentor Xpedition, Altium Designer)  Practical knowledge of 3D modeling CAD (SolidWorks, Autodesk Inventor)  Soldering tools and Measurement equipment (PSU, DMM, oscilloscopes, spectrum analyzers, power meters, etc.)  Practical knowledge of SoCs, MCUs and related design software  Experienced with hardware debug methods to bring-up electronic devices  General practical knowledge of programming languages as C/C++, VBS, Pascal, Python, ASM

Contact form

Contact details