Description
System in Package Assembly Engineer
The task as an assembly engineer for SIP packaging within imec IC-link you act as the technical support interface between our international customers and the different assembly houses. You take up responsibility for the full project management.
The responsibilities will be to defining the package type with the customer and sub-contractor. Technical support between customer and sub-contractor. Development of Modules, MCM, substrates for new type of packages together with our subcontractor. Manage all package development activities including conceptual design, feasibility study, substrate fabrication, assembly. Organizing the flow of the volume production assembly. Discussing the potential yield and/or reliability issues, failure analysis, process improvements.
The required experience and skills:
-Knowledge of assembly manufacturing processes and assembly flow including SMT, die prep, die attach, flip chip, underfilling, wire bonding, molding, singulation and Back End processes.
-Experience in schematic capture, layout and design using Cadence SIP.
-Knowledge in engineering design tools:
-AutoCAD
-ANSYS SIwave
-HFSS.
-Familiar with BGA package substrate technologies
-Experience in project-based work. You are pro-active and customer focused, like to take initiatives and you are very motivated to work within a team of engineers.
-Excellent communication skills that can enable the candidate to work well with internal cross functional teams and overseas suppliers.
For this position a good knowledge of English is mandatory. This position will be a mixture of onsite in Belgium and remote work.