Description
Sr. Package & Assembly engineer - Netherlands - Sr. Package & Assembly engineer
scope of work: Package & Assembly is a key item for PL RF Power & Base stations. New product developments for high power transistors and modules impose challenging requirements on cost reductions, innovations on package- and assembly (eg new materials and production techniques) and time-to-market.
The Sr. Package & Assembly engineer has a broad range of skills on the following areas:
- Package innovation
- Volume manufacturing
- Building and maintaining contacts with key suppliers
Skills: Package design experience with hands on experience on layout, physical design, substrate design and package design of CSP, BGA & FC/C4 package types, working with assembly and product design engineers in the definition and validation of package and assembly design rules. 3-5 years
skills: AutoCAD and Cadence design tools 3-5 years
skills: performing geometric dimensioning and tolerancing (GDT) during device design 3-5 years
skills: Experience as a package designer in at least 2-3 package development platforms, completing the correlation between design rules and assembly/test yields, package performance, device reliability and device electrical performance
sector know-how: high frequency behaviour of packaging/volume manufacturing > 5 years
foreign language: English speaking and writing
project language: English
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