Description
Senior Package & Assembly Engineer required by an international market leader in Integrated Circuit development based within the Product Line RF Power & Basestations on a contract basis in The Netherlands. Package & Assembly Engineers will provide RF designers with information and hardware (packages) to enable them to develop competitive high power RF transistors.The Role:
To be successful within this role and deliver against the challenges associated with new product developments for high power transistors and modules the Senior Package & Assembly Engineer will need to demonstrate skills in package innovation, volume manufacturing and building & maintaining contacts with key suppliers.
Responsibilities:
. Responsible for the development and production release of new RF Power Packages.
. Contribute to implement and execute the product line assembly road map.
. Generate and validate new assembly design rules for new device designs that will use standard package types above plus other new technologies (C4/FC, SMPA, pallet and PCB integrated PA designs)
. Participate in design reviews of new devices, critiquing compliance of new designs to existing DRs and formulating new DR guidelines for next generation concepts.
. Participate in design flow optimization activities among device designers, RF electrical engineers, and physical/layout designers
Essential Skills & Experience:
. A minimum of 3 years experience in package design with hands on experience of layout, physical design, substrate design and package design of CSP, BGA & FC/C4 package types, working with assembly and product design engineers in the definition and validation of package and assembly design rules.
. Experience with AutoCAD and Cadence design tools
. Experience in performing geometric dimensioning and tolerancing (GDT) during device design.
. Experience as a package designer in at least 2-3 package development platforms.
This is potentially a long term contract position within an expanding forward thinking organisation.