Assembly Support Engineer (Flipchip/Wirebonding/SMT)

Flemish Brabant Province  ‐ Onsite
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Keywords

Surface-Mount Technology Wire Bonding Chemistry Electrical Engineering Welding Business Process Improvement Design of Experiments Document Management Systems Electronics Manufacturing Semiconductor Mechanical Engineering Manufacturing Quality Management Statistical Process Control (SPC) Statistics Subcontractors Relationship Management

Description

Assembly Support Engineer (Flipchip/Wirebonding/SMT processes)

Initial 1 year freelance contract + extensions

Leuven, Belgium

Please note that working from home is not possible for this position, as the nature of the tasks involved requires being physically present in the office. We believe in fostering a vibrant and interactive work environment that promotes effective collaboration, creativity, and productivity in this challenging assignment.

Support & coordinate assembly engineering related activities to suppliers/subcontractors to make sure that assembled devices will have no issue and is delivered in time.

The assignment

  • Lead the development and implementation of flipchip, wirebonding, and SMT assembly processes to meet quality, cost, and delivery targets.
  • Collaborate with cross-functional teams, including R&D, Manufacturing, and Quality Assurance, to drive new product and resolve assembly-related issues.
  • Conduct process characterization and optimization studies to improve yield, efficiency, and reliability.
  • Provide technical expertise and guidance on assembly processes.
  • Maintain documentation, including work instructions, and process specifications.

Required knowledge and skills

  • Bachelor's degree in Mechanical Engineering, Electrical Engineering, or a related field. Advanced degree preferred.
  • Minimum 5 years of experience in assembly engineering, with a focus on flipchip, wirebonding, and SMT processes in a semiconductor or electronics manufacturing environment.
  • Proficiency in using assembly equipment such as wire bonders, flipchip bonders, and SMT placement machines.
  • Strong understanding of assembly materials, including solder, adhesives, and underfills.
  • Experience with statistical analysis tools and methodologies for process optimization (eg, Design of Experiments, Statistical Process Control).
  • Excellent problem-solving skills and the ability to troubleshoot complex assembly issues.
  • Hands-on experience in flipchip, wirebonding, and SMT assembly processes.
Start date
ASAP
Duration
12 months+
(extension possible)
From
Consol Partners
Published at
13.05.2024
Project ID:
2749498
Contract type
Freelance
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