Description
Assembly Support Engineer (flipchip, wirebonding, SMT processes)
Initial 12 month contract + option to extend
Leuven, Belgium
Support & coordinate assembly engineering related activities to suppliers/subcontractors to make sure that assembled devices will have no issue and is delivered in time.
The assignment
- Lead the development and implementation of flipchip, wirebonding, and SMT assembly processes to meet quality, cost, and delivery targets.
- Collaborate with cross-functional teams, including R&D, Manufacturing, and Quality Assurance, to drive new product and resolve assembly-related issues.
- Conduct process characterization and optimization studies to improve yield, efficiency, and reliability.
- Provide technical expertise and guidance on assembly processes.
- Maintain documentation, including work instructions, and process specifications
Required knowledge and skills
- Minimum 5 years of experience in assembly engineering, with a focus on flipchip, wirebonding, and SMT processes in a semiconductor or electronics manufacturing environment.
- Proficiency in using assembly equipment such as wire bonders, flipchip bonders, and SMT placement machines.
- Strong understanding of assembly materials, including solder, adhesives, and underfills.
- Experience with statistical analysis tools and methodologies for process optimization (eg, Design of Experiments, Statistical Process Control).
- Excellent problem-solving skills and the ability to troubleshoot complex assembly issues.