Surface conditioning for Power Packaging

Stuttgart, Baden-Württemberg  ‐ Hybrid

Keywords

Consulting Electromagnetic Compatibility Research

Description

Project context:

-Development of a surface conditioning process for power substrates (DCB , AMB ) suitable for optimized adhesion of electronic mold compounds (EMC «Epoxy molding compounds> ).
-Definition of suitable quality criteria for copper surface w.r.t. mold adhesion.
-Development of inhouse processes or supplier processes to reach defined quality criteria (technical consulting of substrate supplier)

We are seeking a skilled and driven Technical Specialist to develop surface conditioning processes for DCB and AMB substrates, define copper surface quality criteria for EMC adhesion, and lead in-house or supplier-based process improvements.

The required skills would be:

• Knowledge about adhesion between Epoxy based materials and copper surfaces
• Strong knowledge about processes for surface cleaning and conditioning (e.g. plasma, wet-chemical cleaning, primers)
• Practical experience in industrial scale

The main task of the project:

Technical consulting of Bosch development team and supplier

Other responsibilities within the project include:

• Collecting requirements from internal manufacturing processes with interaction to copper surfaces
• Line walks at Bosch manufacturing and suppliers
• Proposing optimizations for existing inhouse and supplier processes
• Investigation and evaluation of alternatives (technically, commercially, maturity, time-line)

Start date
06.2025
Workload
60% (3 days per week)
Duration
6 months
(extension possible)
From
Robert Bosch GmbH
Published at
20.05.2025
Contact person:
LegendsLab Team
Project ID:
2880638
Industry
IT
Contract type
Freelance
Workplace
80 % remote
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