Description
World Class Defence Organisation based in Bolton, Lancashire is currently looking to recruit 2x PCB Engineers (Surface Mount Technology) subcontractor on an initial 6 month contract.
Hourly Rate: The department are offering very competitive hourly rates.
Contract Duration: 6 months (initially and then ongoing and long-term thereafter)
Security Information: Please Note you must be eligible for SC Security Clearance (unfortunately due to security restrictions for this role, the candidate will need to be a British National with no dual nationality and must have resided in the UK for at least 4 of the past 5 years).
PCB Engineer (Surface-Mount Technology) Job Description:
As a Process Engineer within the CCA manufacturing facility your focus will be to ensure that our products are built efficiently, with the most modern tools available.
As a Process Engineer you will demonstrate ownership of processes and equipment in the SMT PCB manufacturing facility. Support equipment upgrades from purchase through installation. Conduct cost/benefit analysis for changes to processes and/or equipment. Drive Process Improvement/Cycle Reduction initiatives and drive productivity improvements via process change or improvements. Support the quality function through identification and elimination of product non-conformances.
Formal technical Engineering/Craft Apprenticeship to NVQ Level 3/TR23/TR21. Formal further education certificate to HNC or equivalent in a relevant subject. Experience in Circuit Card Assembly equipment. 5 years experience within SMT PCB manufacturing environment. Strong working knowledge of Electronic assembly, utilising the following equipment/processes: DEK printer, MYDATA, Solder reflow, Selective Solder etc. Experience of PCB ruggadisation processes such as Underfill and Conformal Coating would be advantages. Should be IPC J Std-001 and IPC-610 certified. Manual handling training. ESD training. Colophony health surveillance.
Skills and Experience Required:
Formal further education certificate to HNC or equivalent in a relevant subject. Experience in Circuit Card Assembly equipment.
5 years experience within SMT PCB manufacturing environment.
Strong working knowledge of Electronic assembly, utilising the following equipment/processes: DEK printer, MYDATA, Solder reflow, Selective Solder etc. Experience of PCB ruggadisation processes such as Underfill and Conformal Coating would be advantages.
Should be IPC J Std-001 and IPC-610 certified.
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