Description
Sr Package and Assembly Engineer - RF Power and Base Stations
Location: Njimegen
Length: 12 month contract
Rates: Negotiable
Package & Assembly is a key item for PL RF Power & Base stations. New product developments for high power transistors and modules impose challenging requirements on cost reductions, innovations on package- and assembly (eg new materials and production techniques) and time-to-market.
The Sr. Package & Assembly engineer has a broad range of skills on the following areas:
- Package innovation
- Volume manufacturing
- Building and maintaining contacts with key suppliers
Key Responsibilities
Responsible for development and production release of new RF power packages. This includes both technical content as well as project leader aspects.
Establish and implement new assembly processes. This is done in close cooperation with our Far-East assembly centre.
Contribute to implement the PL Assembly Roadmap: -Translate requirements of product roadmaps to assembly roadmap - Advice and suggest new technologies to product roadmap, based on market and technology trends
Execution of Assembly roadmap: project management wise implementation of agreed (BCaM wise) assembly roadmap projects. Monitoring and reporting project progress against objectives (target spec, budget, timing, resources).
An important aspect of the Assembly roadmaps is cost reduction. This means that price aspects need to be discussed with suppliers.
Active participation in industrial improvement teams
Own and maintain assembly design rules for High Performance RF, primarily DRs for overmold types but also support maintenance of existing DRs for ceramic and other packages.
Generate and validate new assembly design rules for new device designs that will use standard package types above plus other new technologies, ie C4/FC, SMPA, pallet and PCB-integrated PA designs, etc.
Generate test vehicle concepts that can be used for the definition of new assembly and package design rules.
Complete assembly design rule validation and equipment MCA during package development, from initial tolerance analysis to DOE planning/execution and documentation.
Guide assembly site activities for DR determination at design phases through validation.
Publish DRs to RF designers for guidance when generating concept designs, lead products or derivatives.
Participate in design reviews of new devices, critiquing compliance of new designs to existing DRs and formulating new DR guidelines for next generation concepts.
Synthesize new DRs for new packaging technologies.
Participate in design flow optimization activities among device designers, RF electrical engineers, and physical/layout designers
Experience in working in teams
Minimum 3-5years experience in package design with hands on experience on layout, physical design, substrate design and package design of CSP, BGA & FC/C4 package types, working with assembly and product design engineers in the definition and validation of package and assembly design rules
3-5 years experience with AutoCAD and Cadence design tools
3-5 years experience in performing geometric dimensioning and tolerancing (GDT) during device design
Experience as a package designer in at least 2-3 package development platforms, completing the correlation between design rules and assembly/test yields, package performance, device reliability and device electrical performance